Chuangfei Xinyuan adopts the world's leading 12 "wafer process and is committed to promoting a full range of high-performance and highly cost-effective Mosfet products.
The company's core patent application: Deep Trench Double Gate deep groove double gate technology, launching a more high-performance and cost-effective medium and low voltage Mosfet, providing customers with better selection references.

The product series includes:
CSP Mosfet,
Planar planar type
Trench groove type
SGT shielding grid type
Multi EPI SJ multilayer epitaxial superjunction type