Quality Control
Process Quality Control
  Mass production process Quality control methods Quality standard requirements
Wafer incoming materials Macro inspection
Microscopic examination
Test yield target control
PCS
5ea/PCS
 300ea/PCS, yield of 95.67%/as per customer requirements
Packaging process Bull; Macro inspection
Microscopic examination
SPC& Cpk control
PCS
5ea/PCS
 Knife marks within the control line, CPK≥ 1.67
FT testing Test yield target control
 QA electrical AQL sampling
Peeling force test
Electrical yield>92.7%, O/S defect<0.5%
AQL0.065
35-85g
FVI OQC  Visual inspection
Shipment inspection
 Visual inspection
 FVI, OQC AQL0.065
Quality control of incoming materials